Abstract: A finite element simulation model for stacked solder joints was established and subjected to random vibration modal analysis and stress-strain analysis. Based on the Manson high-cycle ...
X-ray metrology for solder joint voids faces challenges in precise measurement due to limited annotated data, resulting in uncertainty and reduced accuracy. To address this, we propose Ultra ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results