Ansys divest requirements; SIA Factbook; McKinsey effects of tariffs; ASE's fan-out bridge; earnings; TSMC's design center; ...

A new technical paper titled “Ramping Up Open-Source RISC-V Cores: Assessing the Energy Efficiency of Superscalar, ...

Edge AI, GenAI, and next-gen communications are adding more workloads to phones that are already under pressure to deliver ...

Multi-die assemblies enable more analog content, but that adds new security vulnerabilities for which there is little ...

Context-aware computing enables ultra-low-power operation while maintaining high-performance AI capabilities when needed.

Commercialization has started for network switches based on co-packaged optics (CPO), which are capable of routing signals at ...

Smart glasses with augmented reality functions look more natural than VR goggles, but today they are heavily reliant on a ...

End-to-end solution that enhances EM analysis, improves co-design efficiency, and accelerates RF integration within ...

Today, we are witnessing a paradigm shift towards a more modular design approach that disaggregates SoC functions into ...

The researchers used it to map stray magnetic fields from CoFeB–SiO2 thin films used in high-frequency inductors. They ...

Loss Integration of High-Density Polymer Waveguides with Silicon Photonics for Co-Packaged Optics” was published by ...

The semiconductor industry is undergoing a fundamental shift from monolithic chip designs to chiplet-based architectures.