Abstract: This paper describes the architecture of the wafer-on-wafer (WOW) via-last through silicon via (TSV), named Bumpless Build Cube-TSV (BBCube-TSV). At first, the three types of TSVs, $\mu $ ...

Modern devices, from fitness trackers and smart garments to Internet of Things (IoT) sensors, require compact and sustainable ...

Discover how to build a simple electric train using just a copper coil, an AA battery, and disc magnets in this step-by-step ...

A novel magnetic material with an extraordinary electronic structure might allow for the production of smaller and more efficient computer chips in the future: the p-wave magnet. Researchers from ...

Discover how to build a DIY magnetic stirrer from basic materials in this easy-to-follow tutorial. Perfect for mixing tea, coffee, or even for science experiments, this homemade magnetic stirrer uses ...